Qualcomm presented at CES 2021 the second generation of its 3D sonic sensor, the latest version of ultrasonic digital printing technology on the screen. This new version promises a larger operating area and a faster and more effective unlocking of the terminals.
Despite being a second iteration of a product that is already very popular, Qualcomm has not stopped itself from taking a huge leap this year in terms of quality.
Qualcomm’s new sensor is faster and more reliable
In relation to the first model, we now have a 77% larger operating area, which means that it will take you less time to press the correct area of the screen to unlock the smartphone. At the same time, the sensor will be able to collect more data, which enhances its security level.
By combining a larger actuation surface with faster processing speed, unlocking can be up to 50% faster than what was possible with the previous version.
The first generation of the 3D Sonic Sensor made its debut in the Samsung Galaxy S10 launched in 2018, using an optical scanner much less reliable than this ultrasonic.
Worse than that, the device suffered from serious security flaws that allowed anyone to unlock a terminal protected by a screen saver.
New technology should debut with the Samsung Galaxy S21
Qualcomm said in its presentation that we will start seeing smartphones equipped with the second generation of the 3D Sonic Sensor as early as 2021.
Bearing in mind that the first version debuted with the Galaxy S10, it will not be unreasonable to judge that this technology will be included in some element of the Galaxy S21 family, even if not all.
Samsung’s new equipment will be officially unveiled this Thursday, January 14th. You can check everything you expect from the three new smartphones in this article.
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